STANNOL錫膏 SP2500
產(chǎn)品簡介
STANNOL錫膏的印刷適性對焊接結(jié)果的積極影響。 獨特的潤濕配方,滿足了每一系列生產(chǎn)過程中表面潤濕的要求。 STANNOL錫膏回流焊后的少量殘留物是輕的、透明的、電**的,不需要除去。 殘留物少,電氣**性好。穩(wěn)定的印刷特性
產(chǎn)品詳細信息
獨特的潤濕配方,滿足了每一系列生產(chǎn)過程中表面潤濕的要求。
STANNOL無鉛錫膏回流焊后的少量殘留物是輕的、透明的、電**的,不需要除去。
殘留物少,電氣**性好。穩(wěn)定的印刷特性
The solder paste SP2500 has been developed for the high volume, lead-free SMD electronics manufacturing. The solder paste is characterized by less voiding. The long open times and the high printability have a positive effect on the soldering result. With a special formula for excellent wetting, it meets the requirements for wetting on the surfaces which can be found today in every series manufacturing process.
The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.
PRODUCT ADVANTAGES
Less voiding
Reflow under air and nitrogen atmosphere possible
Long open times of the paste
No-Clean
Less residues, good electrical safety
Stable printing characteristics
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- 注冊時間: 2017-06-02
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